English
Language : 

HCTS193MS Datasheet, PDF (6/9 Pages) Intersil Corporation – Radiation Hardened Synchronous 4-Bit Up/Down Counter
◁
Specifications HCTS193MS
TABLE 5. BURN-IN AND OPERATING LIFE TEST, DELTA PARAMETERS (+25oC)
PARAMETER
ICC
IOL/IOH
GROUP B
SUBGROUP
5
5
DELTA LIMIT
12µA
-15% of 0 Hour
TABLE 6. APPLICABLE SUBGROUPS
CONFORMANCE GROUPS
METHOD
GROUP A SUBGROUPS
READ AND RECORD
Initial Test (Preburn-In)
100%/5004
1, 7, 9
ICC, IOL/H
Interim Test I (Postburn-In)
100%/5004
1, 7, 9
ICC, IOL/H
Interim Test II (Postburn-In)
100%/5004
1, 7, 9
ICC, IOL/H
PDA
100%/5004
1, 7, 9, Deltas
Interim Test III (Postburn-In)
100%/5004
1, 7, 9
ICC, IOL/H
PDA
100%/5004
1, 7, 9, Deltas
Final Test
100%/5004
2, 3, 8A, 8B, 10, 11
Group A (Note 1)
Sample/5005
1, 2, 3, 7, 8A, 8B, 9, 10, 11
Group B
Subgroup B-5
Sample/5005 1, 2, 3, 7, 8A, 8B, 9, 10, 11, Deltas Subgroups 1, 2, 3, 9, 10, 11
Subgroup B-6
Sample/5005
1, 7, 9
Group D
Sample/5005
1, 7, 9
NOTE: 1. Alternate Group A testing in accordance with method 5005 of MIL-STD-883 may be exercised.
TABLE 7. TOTAL DOSE IRRADIATION
CONFORMANCE
GROUPS
METHOD
TEST
PRE RAD
POST RAD
Group E Subgroup 2
5005
1, 7, 9
Table 4
NOTE: 1. Except FN test which will be performed 100% Go/No-Go.
READ AND RECORD
PRE RAD
POST RAD
1, 9
Table 4 (Note 1)
TABLE 8. DYNAMIC BURN-IN TEST CONNECTIONS
OPEN
GROUND
1/2 VCC = 3V ± 0.5V
VCC = 6V ± 0.5V
STATIC BURN-IN I TEST CONNECTIONS (Note 1)
2, 3, 6, 7, 12, 13
1, 4, 5, 8 - 11, 14, 15
-
16
STATIC BURN-IN II TEST CONNECTIONS (Note 1)
2, 3, 6, 7, 12, 13
8
-
1, 4, 5, 9 - 11, 14 - 16
DYNAMIC BURN-IN TEST CONNECTIONS (Note 2)
-
1, 8 - 10, 14, 15
2, 3, 6, 7, 12, 13
4, 11, 16
NOTES:
1. Each pin except VCC and GND will have a resistor of 10KΩ ± 5% for static burn-in.
2. Each pin except VCC and GND will have a resistor of 1KΩ ± 5% for dynamic burn-in.
OSCILLATOR
50kHz
25kHz
-
-
-
-
5
-
TABLE 9. IRRADIATION TEST CONNECTIONS
OPEN
GROUND
VCC = 5V ± 0.5V
2, 3, 6, 7, 12, 13
8
1, 4, 5, 9 - 11, 14 - 16
NOTE: Each pin except VCC and GND will have a resistor of 47KΩ ± 5% for irradiation testing. Group
E, Subgroup 2, sample size is 4 dice/wafer 0 failures.
Spec Number 518620
597
 ▷