HCS32MS_07 Datasheet, PDF (9/11 Pages) Intersil Corporation – Radiation Hardened Quad 2-Input OR Gate

Die Characteristics
DIE DIMENSIONS:
87milsx88 mils
2.20mmx2.2mm
METALLIZATION:
Type: SiAl
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO₂
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 10⁵A/cm²
BOND PAD SIZE:
100μm x 100μm
4milsx4mils
Metallization Mask Layout
A1
(1)
HCS32MS
HCS32MS
VCC
B4
(14)
(13)
B1 (2)
Y1 (3)
A2 (4)
B2 (5)
(6)
(7)
(8)
Y2
GND
Y3
9
(12) A4
(11) Y4
(10) B3
(9) A3
FN3057.1
April 11, 2007