HCS32MS_07 Datasheet, PDF (3/11 Pages) Intersil Corporation – Radiation Hardened Quad 2-Input OR Gate

HCS32MS
Absolute Maximum Ratings
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7.0V
Input Voltage Range, All Inputs . . . . . . . . . . . . . -0.5V to VCC +0.5V
DC Input Current, Any One Input. . . . . . . . . . . . . . . . . . . . . . ±10mA
DC Drain Current, Any One Output . . . . . . . . . . . . . . . . . . . . ±25mA
(All Voltage Reference to the VSS Terminal)
Storage Temperature Range (TSTG). . . . . . . . . . . .-65°C to +150°C
Lead Temperature (Soldering 10sec). . . . . . . . . . . . . . . . . . . +265°C
Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . +175°C
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
Operating Conditions
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V
Input Rise and Fall Times at VCC = 4.5V (TR, TF) . . . 100ns/V Max
Operating Temperature Range (TA). . . . . . . . . . . . .-55°C to +125°C
Input Low Voltage (VIL) . . . . . . . . . . . . . . . . . . . 0.0V to 30% of VCC
Input High Voltage (VIH) . . . . . . . . . . . . . . . . . .70% of VCC to VCC
Thermal Information
Thermal Resistance (Notes 1, 2)
θJA
θJC
SBDIP Package . . . . . . . . . . . . . . . . . 74°C/W 24°C/W
Ceramic Flatpack Package . . . . . . . . . 116°C/W 30°C/W
Maximum Package Power Dissipation at +125°C Ambient
SBDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.68W
Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . . . . . . . . .0.43W
If device power exceeds package dissipation capability, provide heat
sinking or derate linearly at the following rate:
SBDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13.5mW/°C
Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . . . . . .8.6mW/°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. θ_JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
2. For θ_JC, the “case temp” location is the center of the exposed metal pad on the package underside.
DC Electrical Electrical Performance Characteristics
PARAMETER
Quiescent Current
SYMBOL
TEST CONDITIONS
ICC
VCC = 5.5V, VIN = VCC or
GND
Output Current (Sink)
IOL
VCC = 4.5V, VIH = 4.5V,
VOUT = 0.4V, VIL = 0V
Output Current (Source)
Output Voltage Low
Output Voltage High
Input Leakage Current
IOH
VOL
VOH
IIN
VCC = 4.5V, VIH = 4.5V,
VOUT = VCC -0.4V,
VIL = 0V
VCC = 4.5V, VIH = 3.15V,
IOL = 50μA, VIL = 1.35V
VCC = 5.5V, VIH = 3.85V,
IOL = 50μA, VIL = 1.65V
VCC = 4.5V, VIH = 3.15V,
IOH = -50μA, VIL = 1.35V
VCC = 5.5V, VIH = 3.85V,
IOH = -50μA, VIL = 1.65V
VCC = 5.5V, VIN = VCC or
GND
Noise Immunity Functional Test
FN
VCC = 4.5V, VIH = 0.70
(VCC), VIL = 0.30(VCC),
(Note 3)
NOTES:
3. This is just to show continuing notes in the document.
4. This is a row format electrical spec table.
GROUP A
SUBGROUPS
1
2, 3
1
2, 3
1
2, 3
TEMP (°C)
+25
+125, -55
+25
+125, -55
+25
+125, -55
1, 2, 3
+25, +125, -55
LIMITS
MIN
MAX
-
10
-
200
4.8
-
4.0
-
-4.8
-
-4.0
-
-
0.1
1, 2, 3
+25, +125, -55
-
0.1
1, 2, 3
+25, +125, -55 VCC - 0.1
-
1, 2, 3
+25, +125, -55 VCC - 0.1
-
1
+25
-
±0.5
2, 3
+125, -55
-
±5.0
7, 8A, 8B +25, +125, -55
-
-
UNITS
μA
μA
mA
mA
mA
mA
V
V
V
V
μA
μA
-
3
FN3057.1
April 11, 2007