HCS139MS Datasheet, PDF (9/9 Pages) Intersil Corporation – Radiation Hardened Dual 2-to-4 Line Decoder/Demultiplexer

Die Characteristics
DIE DIMENSIONS:
106 mils x 108 mils x 19 mils 1 mils
METALLIZATION:
Type: SiAl
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO₂
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 10⁵A/cm²
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
HCS139MS
HCS139MS
1A1 (3)
1Y0 (4)
1Y1 (5)
1Y2 (6)
(14) 2A0
(13) 2A1
(12) 2Y0
(11) 2Y1
(10) 2Y2
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCS139 is TA14309A.
Spec Number 518832
161