ISL6313B Datasheet, PDF (6/33 Pages) Intersil Corporation – Two-Phase Buck PWM Controller with Integrated MOSFET Drivers for Intel VR11 and AMD Applications

ISL6313B
Absolute Maximum Ratings
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6V
Supply Voltage, PVCC . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +15V
BOOT Voltage, V_BOOT . . . . . . . . . . . . . . GND - 0.3V to GND + 36V
BOOT to PHASE Voltage, V_BOOT-PHASE . . . . . . -0.3V to 15V (DC)
-0.3V to 16V (<10ns, 10µJ)
PHASE Voltage, V_PHASE . . . . . . . GND - 0.3V to 15V (PVCC = 12)
GND - 8V (<400ns, 20µJ) to 24V (<200ns, V_{BOOT - PHASE} = 12V)
UGATE Voltage, V_UGATE. . . . . . . . V_PHASE - 0.3V to V_BOOT + 0.3V
V_PHASE - 3.5V (<100ns Pulse Width, 2µJ) to V_BOOT + 0.3V
LGATE Voltage, V_LGATE . . . . . . . . . . . GND - 0.3V to PVCC + 0.3V
GND - 5V (<100ns Pulse Width, 2µJ) to PVCC + 0.3V
Input, Output, or I/O Voltage . . . . . . . . . GND - 0.3V to VCC + 0.3V
Thermal Information
Thermal Resistance
θ_JA (°C/W) θ_JC (°C/W)
TQFN Package (Notes 1, 2) . . . . . . . . .
32
2.0
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C
Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Recommended Operating Conditions
VCC Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+5V ±5%
PVCC Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . +5V to 12V ±5%
Ambient Temperature
ISL6313BCRZ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
ISL6313BIRZ . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
1. θ_JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
2. For θ_JC, the “case temp” location is the center of the exposed metal pad on the package underside.
3. Limits established by characterization and are not production tested.
Electrical Specifications
Recommended Operating Conditions, Unless Otherwise Specified. Parameters with MIN and/or MAX limits are
100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are
not production tested.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
BIAS SUPPLIES
Input Bias Supply Current
Gate Drive Bias Current - PVCC Pin
VCC POR (Power-On Reset)
Threshold
I_VCC; EN = high
I_PVCC; EN = high
VCC rising
VCC falling
10
14
17
mA
2
4.2
6
mA
4.25
4.38
4.50
V
3.75
3.87
4.00
V
PVCC POR (Power-On Reset)
Threshold
PVCC rising
PVCC falling
4.25
4.38
4.50
V
3.75
3.87
4.00
V
PWM MODULATOR
Oscillator Frequency Accuracy, F_SW R_T = 100kΩ (±0.1%)
(ISL6313BCRZ)
225
250
275
kHz
Oscillator Frequency Accuracy, F_SW R_T = 100kΩ (±0.1%)
(ISL6313BIRZ)
215
250
280
kHz
Adjustment Range of Switching
Frequency
(Note 3)
0.08
-
1.0
MHz
Oscillator Ramp Amplitude, V_P-P
CONTROL THRESHOLDS
(Note 3)
-
1.50
-
V
EN Rising Threshold
0.84
0.85
0.88
V
EN Hysteresis
-
100
-
mV
REFERENCE AND DAC
System Accuracy (1.000V to 1.600V)
-0.5
-
0.5
%
System Accuracy (0.600V to 1.000V)
-1.0
-
1.0
%
System Accuracy (0.375V to 0.600V)
-2.0
-
2.0
%
DAC Input Low Voltage (INTEL)
-
-
0.4
V
6
FN6809.0
November 6, 2008