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| 82C83H Datasheet, PDF (6/6 Pages) Intersil Corporation – CMOS Octal Latching Inverting Bus Driver | |||
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Die Characteristics
DIE DIMENSIONS:
138.6 x 155.5 x 19 ± 1 mils
METALLIZATION:
Type: Silicon - Aluminum
Thickness: 11kÃ
± 2kÃ
Metallization Mask Layout
DI2 DI1
82C83H
GLASSIVATION:
Type: SiO2
Thickness: 8kÃ
± 1kÃ
WORST CASE CURRENT DENSITY:
2.0 x 105 A/cm2
82C83H
DI2 VCC
DO0
DO1
DO2
DI3
DO3
DI4
DO4
DI5
DO5
DI6
DI7
OE GND
STB
DO7 DO6
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certiï¬cation.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or speciï¬cations at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
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