ISL26712_14 Datasheet, PDF (5/21 Pages) Intersil Corporation – 12-Bit, 10-Bit and 8-Bit, 1MSPS SAR ADCs

ISL26712, ISL26710, ISL26708
Absolute Maximum Ratings
Any Pin to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6.0V
Analog Input to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to V_DD + 0.3V
Digital I/O to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to V_DD + 0.3V
Digital Input Voltage to GND . . . . . . . . . . . . . . . . . . . . . . -0.3V to V_DD + 0.3V
Maximum Current In to Any Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10mA
ESD Rating
Human Body Model (Tested per JESD22-A114F) . . . . . . . . . . . . . . . . 8kV
Machine Model (Tested per JESD22-A115B) . . . . . . . . . . . . . . . . . 400V
Charged Device Model (Tested per JESD22-C101E)
TDFN Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.0kV
SOT-23 Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5kV
Latch Up (Tested per JESD78C; Class 2, Level A) . . . . . . . . . . . . . . . 100mA
Thermal Information
Thermal Resistance (Typical)
θ_JA (°C/W) θ_JC (°C/W)
8 Ld TDFN Package (Notes 6, 8) . . . . . . . . .
41
6
8 Ld SOT-23 Package (Notes 7, 9). . . . . . . . 135
99
Operating Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+150°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
6. θ_JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379.
7. θ_JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
8. For θ_JC, the “case temp” location is the center of the exposed metal pad on the package underside.
9. For θ_JC, the “case temp” location is taken at the package top center.
Electrical Specifications V_DD = +3.0V to +3.6V, F_SCLK = 18MHz, F_S = 1MSPS, V_REF = 2.0V; V_DD = +4.75V to +5.25V, F_SCLK = 18MHz,
F_S = 1MSPS, V_REF = 2.5V; V_CM = V_REF, unless otherwise noted. Typical values are at T_A = +25°C. Boldface limits apply over the operating temperature
range, -40°C to +85°C.
ISL26712
ISL26710
ISL26708
SYMBOL
PARAMETER
MIN
MAX MIN
MAX MIN
MAX
TEST CONDITIONS (Note 10) TYP (Note 10) (Note 10) TYP (Note 10) (Note 10) TYP (Note 10) UNITS
DYNAMIC PERFORMANCE
SINAD Signal-to (Noise +
F_IN = 100kHz
70.0 71.4
61.0 61.6
49.0 49.8
dB
Distortion) Ratio
V_DD = +4.75V to +5.25V
F_IN = 100kHz
68.5 70.5
60.7 61.5
49.0 49.8
dB
V_DD = +3.0V to +3.6V
THD Total Harmonic
Distortion
F_IN = 100kHz
V_DD = +4.75V to +5.25V
-84
-76
-82
-74
-75
-60 dB
F_IN = 100kHz
V_DD = +3.0V to +3.6V
-84
-74
-82 -72
-73
-60 dB
SFDR Spurious Free Dynamic F_IN = 100kHz
Range
V_DD = +4.75V to +5.25V
-87
-76
-82
-76
-68
-60 dB
F_IN = 100kHz
V_DD = +3.0V to +3.6V
-85
-74
-82
-74
-68
-60 dB
IMD Intermodulation
2nd and 3rd order,
-89
-83
-81
dB
Distortion
F_IN = 90kHz, 110kHz
tpd Aperture Delay
1
1
1
ns
Δtpd Aperture Jitter
15
15
15
ps
β3dB Full Power Bandwidth @ –3dB
15
15
15
MHz
DC ACCURACY
N Resolution
12
10
8
Bits
INL Integral Nonlinearity
-1
±0.4
1
-0.5 ±0.1 0.5
-0.2 ±0.03 0.2 LSB
DNL Differential Nonlinearity Guaranteed no missing -0.95 ±0.3 0.95 -0.5 ±0.1 0.5
codes
-0.2 ±0.03 0.2 LSB
OFFSET Zero-Code Error
Zero Volt Differential Input -6
±0.2
6
-2.5 ±0.2 2.5 -1.25 ±0.03 1.25 LSB
5
FN7999.3
September 5, 2012