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ISL12020 Datasheet, PDF (5/25 Pages) Intersil Corporation – Low Power RTC with VDD Battery Backed SRAM and Embedded Temp Compensation ±5ppm with Auto Day Light Saving
ISL12020
I2C Interface Specifications Test Conditions: VDD=+2.7 to +5.5V, Temperature = -20°C to +70°C, unless otherwise specified. (Continued)
SYMBOL
PARAMETER
TEST CONDITIONS
TYP
MIN
(Note 7) MAX UNITS NOTES
tDH
Output Data Hold Time
From SCL falling edge
0
crossing 30% of VDD, until
SDA enters the 30% to 70%
of VDD window.
tR
SDA and SCL Rise Time
From 30% to 70% of VDD. 20 + 0.1 x Cb
tF
SDA and SCL Fall Time
From 70% to 30% of VDD. 20 + 0.1 x Cb
Cb
Capacitive loading of SDA or SCL Total on-chip and off-chip
10
ns
300
ns
300
ns
400
pF
RPU
SDA and SCL Bus Pull-up Resistor Maximum is determined by
1
kΩ
Off-chip
tR and tF.
For Cb = 400pF, max is about
2~2.5kΩ.
For Cb = 40pF, max is about
15~20kΩ
NOTES:
2. Temperature Conversion is inactive below 2.7V VBAT
3. IRQ/FOUT Inactive.
4. VIL = VDD x 0.1, VIH = VDD x 0.9, fSCL = 400kHz
5. VDD > VBAT +VBATHYS
6. Bit BSW = 0 (Standard Mode), VBAT ≥ 1.8V
7. Specified at +25°C.
8. In order to ensure proper timekeeping, the VDD SR- specification must be followed.
9. Parameter is not 100% tested.
10. These are I2C specific parameters and are not tested, however, they are used to set conditions for testing devices to validate specification.
5
FN6450.0
March 29, 2007