ISL55100A_14 Datasheet, PDF (4/14 Pages) Intersil Corporation – Quad 18V Pin Electronics Driver/Window Comparator

ISL55100A
Absolute Maximum Ratings
V_CC to V_EE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 19V
V_EXT to V_EE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
Input Voltages
DATA, DRV EN, CVX, VH, VL, VINP, COMPX, LOWSWING
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (V_EE - 0.5V) to (V_CC + 0.5V)
Output Voltages
DOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (V_EE - 0.5V) to (VH + 0.5V)
QX . . . . . . . . . . . . . . . . . . . . . (COMP LOW - 0.5V) to (COMP HIGH + 0.5V)
Thermal Information
Thermal Resistance (Typical, Notes 4, 5) _JA (°C/W) _JC (°C/W)
72 Ld QFN Package . . . . . . . . . . . . . . . . . . . 23
2.0
Maximum Junction Temperature (Plastic Package) . . . . . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . . . . . -65°C to +150°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see TB493
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
4. _JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379.
5. For _JC, the “case temp” location is the center of the exposed metal pad on the package underside.
6. Device temperature is closely tied to data-rates, driver loads and overall pin activity. Review “Power Dissipation Considerations” on page 9 for more
information.
Recommended Operating Conditions
PARAMETER
SYMBOL
MIN
MAX
(Note 13)
TYP
(Note 13)
UNITS
Device Power-(V_EXT = V_EE) V_EXT Not Used
V_CC - V_EE
12 (Note 10)
15
18
V
Device Power-(V_EXT = V_EE + 5.5V)
V_CC - V_EE
9 (Note 10)
15
18
V
V_EXT Optional External Logic Power
V_EXT - V_EE
5.5 (Note 10)
5.75
6.0
V
Driver Output High Rail
V_H
V_EE + 1
-
V_CC - 0.5
V
Driver Output Low Rail
V_L
V_EE + 0.5
-
V_EE + 6
V
Comparator Output High Rail
COMP-High
V_EE + 1
-
V_CC - 0.5
V
Comparator Output Low Rail
COMP-Low
V_EE + 0.5
-
V_EE + 6
V
Ambient Temperature
T_A
-40
-
+85
°C
Junction Temperature
T_J
-
-
+150
°C
Electrical Specifications
PARAMETER
Test Conditions: V_CC = 12V, V_EE = -3V, VH = 6V, VL = 0V, Comp-High = 5V, Comp-Low = 0V, V_5V = V_EE and
LOWSWING = V_CC.
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
DRIVER DC CHARACTERISTICS
ISL55100A Output Resistance
R_OUTD I_O = ±200mA, data not toggling
3
4.5
7.0
Ω
ISL55100A DC Output Current
I_OUTD Per Individual driver
±200
-
-
mA
ISL55100A AC Output Current (Note 6)
I_OUTDAC Per Individual driver
-
1.0
-
A
ISL55100A Minimum Output Swing
V_OMIN V_H = 200mV, V_L = 0V
185
-
-
mV
Disabled HIZ Leakage Current
HIZ
V_OUT = V_CC with V_H = V_L + V_EE or V_OUT = VEE
-1
0
1
µA
with V_H = V_L = V_CC
DRIVER TIMING CHARACTERISTICS
Data to DOUT Propagation Delay
t_PD Lowswing Disabled (Note 9)
8
12
16
ns
Lowswing Enabled (Note 9)
9
13
17
ns
Driver Timing Skew, All Edges (Note 7)
-
<1
-
ns
Disable (HIZ) Time
t_DIS DVREN Transition from Enable to Disable
16
18
26
ns
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4
FN7486.3
December 4, 2014