ISL54200 Datasheet, PDF (4/18 Pages) Intersil Corporation – USB 2.0 High/Full Speed Multiplexer

ISL54200
Absolute Maximum Ratings
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6.0V
Input Voltages
FSD2, FSD1, HSD2, HSD1 (Note 6) . - 1V to ((V_DD) +0.3V)
IN, EN (Note 6) . . . . . . . . . . . . . . -0.3V to ((V_DD) +0.3V)
Output Voltages
COMD1, COMD2 (Note 6) . . . . . . . . . . . . . . . . . -1V to 5V
Continuous Current (HSD2, HSD1, FSD2, FSD1) . . . ±40mA
Peak Current (HSD2, HSD1, FSD2, FSD1)
(Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . ±100mA
ESD Rating:
HBM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >7kV
MM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >400V
CDM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >1.4kV
Latch-up Tested per JEDEC; Class II Level A . . . . . at +85°C
Thermal Information
Thermal Resistance (Typical)
θ_JA (°C/W) θ_JC (°C/W)
10 Ld µTQFN (Notes 7, 8) . . . . . . . 145
90
10 Ld TDFN (Notes 9, 10) . . . . . . . 55
16.5
Maximum Junction Temperature (Plastic Package). . +150°C
Maximum Storage Temperature Range. . . . . -65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . -40°C to +85°C
V_DD Supply Voltage Range . . . . . . . . . . . . . . . 2.7V to 5.5V
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact
product reliability and result in failures not covered by warranty.
NOTES:
6. Signals on FSD1, FSD2, HSD1, HSD2, COMD1, COMD2, EN, IN exceeding V_DD or GND by specified amount are clamped. Limit
current to maximum current ratings.
7. θ_JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief
TB379 for details.
8. For θ_JC, the “case temp” location is taken at the package top center.
9. θ_JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach”
features. See Tech Brief TB379.
10. For θ_JC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications - 2.7V to 3.6V Supply Test Conditions: V_DD = +3.3V, GND = 0V, V_INH = 1.4V, V_INL = 0.5V,
V_ENH = 1.4V, V_ENL = 0.5V, (Note 11), Unless Otherwise Specified. Bold-
face limits apply over the operating temperature range, -40°C to
+85°C.
PARAMETER
TEST CONDITIONS
TEMP
MIN
MAX
(°C) (Notes 12, 13) TYP (Notes 12, 13) UNITS
ANALOG SWITCH CHARACTERISTICS
NC Switches (FSD1, FSD2)
Analog Signal Range, V_ANALOG V_DD = 3.3V, IN = 0V, EN = 3.3V
Full
0
-
V_DD
V
ON-Resistance, r_ON
V_DD = 3.3V, IN = 0.5V, EN = 1.4V, I_COMx = 40mA, +25
-
7
10
Ω
V_FSD1 or V_FSD2 = 0V to 3.3V, (See Figure 4)
Full
-
-
15
Ω
r_ON Matching Between
Channels, Δr_ON
V_DD = 3.3V, IN = 0.5V, EN = 1.4V, I_COMx = 40mA, +25
-
0.1
0.35
Ω
V_FSD1 or V_FSD2 = Voltage at max r_ON over signal
range of 0V to 3.3V, (Note 15)
Full
-
-
0.4
Ω
r_ON Flatness, r_FLAT(ON)
V_DD = 3.3V, IN = 0.5V, EN = 1.4V, I_COMx = 40mA, +25
-
4
6
Ω
V_FSD1 or V_FSD2 = 0V to 3.3V, (Note 14)
Full
-
-
8
Ω
OFF Leakage Current, I_FSX(OFF) V+ = 3.6V, IN = 3.6V, EN = 0V and 3.6V, V_COMx +25
-20
2
20
nA
= 0.3V, 3V, V_FSX = 3V, 0.3V
Full
-70
-
70
nA
ON Leakage Current, I_FSX(ON) V+ = 3.6V, IN = 0V, EN = 3.6V, V_COMx = 0.3V, +25
-20
2
20
nA
3V, V_FSX = 0.3V, 3V
Full
-70
-
70
nA
NO Switches (HSD1, HSD2)
Analog Signal Range, V_ANALOG V_DD = 3.3V, IN = 3.3V, EN = 3.3V
Full
0
-
V_DD
V
4
FN6408.2
June 17, 2010