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HFA3783 Datasheet, PDF (34/34 Pages) Intersil Corporation – I/Q Modulator/Demodulator and Synthesizer
HFA3783
Thin Plastic Quad Flatpack Packages (LQFP)
D
D1
-D-
-A-
-B-
E E1
PIN 1
-H-
GAGE
PLANE
0.020
0.008 MIN
0o MIN
L
0o-7o
0.25
0.010
e
SEATING
A PLANE
0.08
0.003
-C-
0.08
0.003
M
C
A-B S
DS
b
11o-13o
b1
0.09/0.16
A2 A1 0.004/0.006
11o-13o
BASE METAL
WITH PLATING
0.09/0.20
0.004/0.008
Q48.7x7A (JEDEC MS-026BBC ISSUE B)
48 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
-
0.062
-
1.60
-
A1
0.002 0.005 0.05
0.15
-
A2
0.054 0.057 1.35
1.45
-
b
0.007 0.010 0.17
0.27
6
b1
0.007 0.009 0.17
0.23
-
D
0.350 0.358 8.90
9.10
3
D1
0.272 0.280 6.90
7.10
4, 5
E
0.350 0.358 8.90
9.10
3
E1
0.272 0.280 6.90
7.10
4, 5
L
0.018 0.029 0.45
0.75
-
N
48
48
7
e
0.020 BSC
0.50 BSC
-
NOTES:
Rev. 2 1/99
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
2. All dimensions and tolerances per ANSI Y14.5M-1982.
3. Dimensions D and E to be determined at seating plane -C- .
4. Dimensions D1 and E1 to be determined at datum plane
-H- .
5. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is 0.25mm (0.010 inch) per side.
6. Dimension b does not include dambar protrusion. Allowable
dambar protrusion shall not cause the lead width to exceed
the maximum b dimension by more than 0.08mm (0.003
inch).
7. “N” is the number of terminal positions.
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site www.intersil.com
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