ISL23315_11 Datasheet, PDF (3/20 Pages) Intersil Corporation – Single, Low Voltage Digitally Controlled Potentiometer

ISL23315
Ordering Information
PART NUMBER
(Note 5)
PART MARKING
RESISTANCE
OPTION
(kΩ)
TEMP RANGE
(°C)
PACKAGE
(Pb-free)
PKG.
DWG. #
ISL23315TFUZ (Notes 1, 3)
3315T
100
-40 to +125 10 Ld MSOP
M10.118
ISL23315UFUZ (Notes 1, 3)
3315U
50
-40 to +125 10 Ld MSOP
M10.118
ISL23315WFUZ (Notes 1, 3)
3315W
10
-40 to +125 10 Ld MSOP
M10.118
ISL23315TFRUZ-T7A (Notes 2, 4) HB
100
-40 to +125 10 Ld 2.1x1.6 µTQFN
L10.2.1x1.6A
ISL23315TFRUZ-TK (Notes 2, 4) HB
100
-40 to +125 10 Ld 2.1x1.6 µTQFN
L10.2.1x1.6A
ISL23315UFRUZ-T7A (Notes 2, 4) HA
50
-40 to +125 10 Ld 2.1x1.6 µTQFN
L10.2.1x1.6A
ISL23315UFRUZ-TK (Notes 2, 4) HA
50
-40 to +125 10 Ld 2.1x1.6 µTQFN
L10.2.1x1.6A
ISL23315WFRUZ-T7A (Notes 2, 4) GZ
10
-40 to +125 10 Ld 2.1x1.6 µTQFN
L10.2.1x1.6A
ISL23315WFRUZ-TK (Notes 2, 4) GZ
10
-40 to +125 10 Ld 2.1x1.6 µTQFN
L10.2.1x1.6A
NOTES:
1. Add “-TK” or “-T7A” suffix for Tape and Reel option. Please refer to TB347 for details on reel specifications.
2. Please refer to TB347 for details on reel specifications.
3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin
plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free
products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
4. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and NiPdAu plate-e4
termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020
5. For Moisture Sensitivity Level (MSL), please see device information page for ISL23315. For more information on MSL please see techbrief TB363.
3
FN7778.1
August 15, 2011