X9520_06 Datasheet, PDF (29/30 Pages) Intersil Corporation – Triple DCP, POR, 2kbit EEPROM Memory, Dual Voltage Monitors

X9520
20-Bump Chip Scale Package (CSP B20)
Package Outline Drawing
a
Top View (Marking Side)
f
A4 A3 A2 A1
B4 B3 B2 B1
b
j
C4 C3 C2 C1
D4 D3 D2 D1
m
E4 E3 E2 E1
l
k
Bottom View (Bumped Side)
e
c
Side View
d
e
Side View
Package Dimensions
Package Width
Package Length
Package Height
Body Thickness
Ball Height
Ball Diameter
Ball Pitch – Width
Ball Pitch – Length
Ball to Edge Spacing – Width
Ball to Edge Spacing – Length
Millimeters
Inches
Symbol Min Nominal Max Min Nominal Max
a
2.542 2.572 2.602
b
3.812 3.842 3.872
c
0.644 0.677 0.710
d
0.444 0.457 0.470
e
0.220 0.240 0.260
f
0.310 0.330 0.350
j
0.5
k
0.5
l
0.511 0.536 0.561
m 0.896 0.921 0.946
Ball Matrix:
4
3
2
1
A RL2 RW2 Vcc V2RO
B V3 RH2 V1RO V2
C WP V3RO RL0 RW0
D SCL MR RH0 RH1
E SDA RL1 RW1 Vss
29
FN8206.1
January 3, 2006