ISL26132 Datasheet, PDF (23/23 Pages) Intersil Corporation – Low-Noise 24-bit Delta Sigma ADC

ISL26132, ISL26134
Package Outline Drawing
M28.173
28 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
Rev 1, 5/10
A
13
9.70± 0.10
28
15
SEE DETAIL "X"
6.40
4.40 ± 0.10
2
3
PIN #1
I.D. MARK
0.20 C B A 1
H
C
SEATING PLANE
0.10 C
14
0.65
B
TOP VIEW
0.15 ^+0.05
-0.06
END VIEW
- 0.05
SIDE VIEW
1.20 MAX
0.90 ^+0.15
-0.10
0.25+-00..0065
5
0.10 M C B A
0.05 MIN
0.15 MAX
1.00 REF
GAUGE
PLANE _0.25
0°-8°
0.60 ±0.15
DETAIL "X"
(5.65)
(1.45)
NOTES:
(0.65 TYP)
(0.35 TYP)
TYPICAL RECOMMENDED LAND PATTERN
1. Dimension does not include mold flash, protrusions or gate burrs.
Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.
2. Dimension does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.25 per side.
3. Dimensions are measured at datum plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
5. Dimension does not include dambar protrusion. Allowable protrusion
shall be 0.08mm total in excess of dimension at maximum material
condition. Minimum space between protrusion and adjacent lead
is 0.07mm.
6. Dimension in ( ) are for reference only.
7. Conforms to JEDEC MO-153.
23
FN6954.1
September 9, 2011