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| ISL73841SEH Datasheet, PDF (20/23 Pages) Intersil Corporation – Radiation Tolerant 30V 32-Channel Analog Multiplexer | |||
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ISL73841SEH
Die Characteristics
Die Dimensions
5000µm x 4080µm (197 mils x 161 mils)
Thickness: 483µm ±25µm (19 mils ±1 mil)
Interface Materials
GLASSIVATION
Type: 12kÃ
Silicon Nitride on 3kÃ
Oxide
TOP METALLIZATION
Type: 300Ã
TiN on 2.8µm AlCu
In Bondpads, TiN has been removed.
BACKSIDE FINISH
Silicon
PROCESS
P6SOI
Metalization Mask Layout
Assembly Related Information
SUBSTRATE POTENTIAL
Floating
Additional Information
WORST CASE CURRENT DENSITY
1.6 x 105 A/cm2
TRANSISTOR COUNT
10752
Weight of Packaged Device
1.54 grams (typical)
Lid Characteristics
Finish: Gold
Potential: Grounded, tied to package pin 29
IN12 IN13
IN14
IN15
IN16
OUT
IN11
IN10
IN9
IN8
IN7
IN6
IN5
IN4
IN3
IN2
IN1
V+
VREF
A0
A1
A2
A3
A4
IN32
IN31
IN30
IN29
IN28
IN27
IN26
IN25
IN24
IN23
IN22
IN21
IN20
IN19
IN18
EN
BAR
GND
Vâ
IN17
Submit Document Feedback 20
FN8846.1
May 31, 2016
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