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ISL78206 Datasheet, PDF (19/19 Pages) Intersil Corporation – 40V 2.5A Buck Controller with Integrated High-side 40V 2.5A Buck Controller with Integrated High-side
ISL78206
Package Outline Drawing
M20.173A
20 LEAD HEAT-SINK THIN SHRINK SMALL OUTLINE PACKAGE (HTSSOP)
Rev 0, 8/13
A
13
6.50 ±0.10
SEE DETAIL "X"
4.20
20
10
6.40
4.40 ±0.10
2
3
0.20 C B A
1
0.65
TOP VIEW
PIN #1
I.D. MARK
EXPOSED
THERMAL PAD
9
B 0.09-0.20
END VIEW
3.00
BOTTOM VIEW
H
C
SEATING
PLANE
0.10 C
- 0.05
1.20 MAX
0.90 +0.15/-0.10
0.25 +0.05/-0.06 5
0.10 M C B A
SIDE VIEW
0 MIN TO 0.15 MAX
1.00 REF
DETAIL "X"
GAUGE
PLANE
0.25
0°-8°
0.60 ±0.15
(4.20)
(1.45) NOTES:
(5.65)
(3.00)
0.6500
(0.35 TYP)
TYPICAL RECOMMENDED LAND PATTERN
1. Dimension does not include mold flash, protrusions or gate burrs.
Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.
2. Dimension does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.25 per side.
3. Dimensions are measured at datum plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
5. Dimension does not include dambar protrusion. Allowable protrusion
shall be 0.80mm total in excess of dimension at maximum material
condition. Minimum space between protrusion and adjacent lead
is 0.07mm.
6. Dimension in ( ) are for reference only.
7. Conforms to JEDEC MO-153.
Submit Document Feedback 19
FN8618.2
March 25, 2015