ISL70419SEH Datasheet, PDF (19/22 Pages) Intersil Corporation – Spectral analysis equipment

ISL70419SEH
Package Characteristics
Weight of Packaged Device
0. 6043 Grams (Typical)
Lid Characteristics
Finish: Gold
Potential: Unbiased; tied to EPAD
Case Isolation to Any Lead: 20 x 10⁹ Ω (min)
Die Characteristics
Die Dimensions
2406µm x 2935µm (95mils x 116mils)
Thickness: 483µm ± 25µm (19mils ± 1 mil)
Interface Materials
GLASSIVATION
Type: Nitrox
Thickness: 15kÅ
Metallization Mask Layout
-IN_A
OUT_A
TOP METALLIZATION
Type: AlCu (99.5%/0.5%)
Thickness: 30kÅ
BACKSIDE FINISH
Silicon
PROCESS
Dielectrically Isolated Complementary Bipolar - PR40
ASSEMBLY RELATED INFORMATION
SUBSTRATE POTENTIAL
Floating
ADDITIONAL INFORMATION
WORST CASE CURRENT DENSITY
< 2 x 10⁵ A/cm²
OUT_D
-IN_D
+IN_A
+IN_D
PLACE HOLDER
V+
V-
+IN_B
-IN_B
OUT_B
+IN_C
OUT_C
-IN_C
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July 11, 2014
FN8653.0