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| ISL70244SEH Datasheet, PDF (19/21 Pages) Intersil Corporation – Rail-to-rail input and output | |||
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Die Characteristics
Die Dimensions
2410µm x 1961µm (95 mils x 77 mils)
Thickness: 483µm ±25µm (19 mils ±1 mil)
Interface Materials
GLASSIVATION
Type: Nitrox
Thickness: 15kÃ
TOP METALLIZATION
Type: AlCu (99.5%/0.5%)
Thickness: 30kÃ
BACKSIDE FINISH
Silicon
PROCESS
PR40
ISL70244SEH
Assembly Related Information
SUBSTRATE POTENTIAL
Floating
Additional Information
WORST CASE CURRENT DENSITY
<2x105A/cm2
TRANSISTOR COUNT
365
Weight of Packaged Device
0.3958 grams (typical)
Lid Characteristics
Finish: Gold
Potential: Unbiased, tied to package pin 6
Case Isolation to Any Lead: 20x109 Ω (minimum)
Metallization Mask Layout
Submit Document Feedback 19
FN8592.2
September 1, 2016
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