ISL6217 Datasheet, PDF (19/19 Pages) Intersil Corporation – Precision Multi-Phase Buck PWM Precision Multi-Phase Buck PWM Positioning IMVP-IV™ and IMVP-IV+

ISL6217
Thin Shrink Small Outline Plastic
Packages (TSSOP)
N
INDEX
AREA
E
E1
-B-
0.25(0.010) M B M
GAUGE
PLANE
123
0.05(0.002) SEATING PLANE
-A-
D
A
L
0.25
0.010
-C-
α
e
A1
A2
c
b
0.10(0.004)
0.10(0.004) M C A M B S
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-153-BD-1, Issue F.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions. Inter
lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual inde
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable damba
protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimen
sion at maximum material condition. Minimum space between protru
sion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact. (Angles in degrees)
M38.173
38 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-153-BD-1 ISSUE F)
SYMBOL
A
A1
A2
b
c
D
E1
e
E
L
N
α
INCHES
MIN
MAX
-
0.047
0.002 0.006
0.031 0.051
0.0075 0.0106
0.0035 0.0079
0.378 0.386
0.169 0.177
0.0197 BSC
0.246 0.256
0.0177 0.0295
38
0^o
8^o
MILLIMETERS
MIN
MAX NOTES
-
1.20
-
0.05
0.15
-
0.80
1.05
-
0.17
0.27
9
0.09
0.20
-
9.60
9.80
3
4.30
4.50
4
0.500 BSC
-
6.25
6.50
-
0.45
0.75
6
38
7
0^o
8^o
-
Rev. 01/03
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