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ISL62884C Datasheet, PDF (18/30 Pages) Intersil Corporation – Single-Phase PWM Regulator for IMVP-6™ Mobile CPUs
ISL62884C
A typical set of parameters that provide good
temperature compensation are: Rsum = 1.82kΩ,
Rp = 11kΩ, Rntcs = 2.61kΩ and Rntc = 10kΩ
(ERT-J1VR103J). The NTC network parameters may need
to be fine tuned on actual boards. One can apply full load
DC current and record the output voltage reading
immediately; then record the output voltage reading
again when the board has reached the thermal steady
state. A good NTC network can limit the output voltage
drift to within 2mV. It is recommended to follow the
Intersil evaluation board layout and current-sensing
network parameters to minimize engineering time.
VCn(s) also needs to represent real-time Io(s) for the
controller to achieve good transient response. Transfer
function Acs(s) has a pole ωsns and a zero ωL. One needs
to match ωL and ωsns so Acs(s) is unity gain at all
frequencies. By forcing ωL equal to ωsns and solving for
the solution, Equation 11 gives Cn value.
Cn
=
------------------------------L--------------------------------
-R----n---t--c---n----e---t---×-----R----s---u----m--
Rntcnet + Rsum
×
DCR
(EQ. 11)
io
Vo
FIGURE 11. DESIRED LOAD TRANSIENT RESPONSE
WAVEFORMS
io
Vo
FIGURE 12. LOAD TRANSIENT RESPONSE WHEN Cn IS
TOO SMALL
io
Vo
For example, given Rsum = 1.82kΩ, Rp = 11kΩ,
Rntcs = 2.61kΩ, Rntc = 10kΩ, DCR = 19.7mΩ and
L = 1.5µH, Equation 11 gives Cn = 0.055µF.
Assuming the compensator design is correct, Figure 11
shows the expected load transient response waveforms if
Cn is correctly selected. When the load current Icore has
a square change, the output voltage Vcore also has a
square response.
If Cn value is too large or too small, VCn(s) will not
accurately represent real-time Io(s) and will worsen the
transient response. Figure 12 shows the load transient
response when Cn is too small. Vcore will sag excessively
upon load insertion and may create a system failure.
Figure 13 shows the transient response when Cn is too
large. Vcore is sluggish in drooping to its final value.
There will be excessive overshoot if load insertion occurs
during this time, which may potentially hurt the CPU
reliability.
Figure 14 shows the output voltage ring back problem
during load transient response. The load current io has a
fast step change, but the inductor current iL cannot
accurately follow. Instead, iL responds in first order
system fashion due to the nature of current loop. The
ESR and ESL effect of the output capacitors makes the
output voltage Vo dip quickly upon load current change.
However, the controller regulates Vo according to the
droop current idroop, which is a real-time representation
of iL; therefore it pulls Vo back to the level dictated by iL,
causing the ring back problem. This phenomenon is not
observed when the output capacitors have very low ESR
and ESL, such as all ceramic capacitors.
Figure 15 shows two optional circuits for reduction of the
ring back. Rip and Cip form an R-C branch in parallel with
Ri, providing a lower impedance path than Ri at the
beginning of io change. Rip and Cip do not have any
effect at steady state. Through proper selection of Rip
and Cip values, idroop can resemble io rather than iL, and
Vo will not ring back. The recommended value for Rip is
100Ω. Cip should be determined through tuning the load
transient response waveforms on an actual board. The
recommended range for Cip is 100pF~2000pF. However,
it should be noted that the Rip -Cip branch may distort
the idroop waveform. Instead of being triangular as the
real inductor current, idroop may have sharp spikes,
which may adversely affect idroop average value
detection and therefore may affect OCP accuracy. User
discretion is advised.
iO
iL
FIGURE 13. LOAD TRANSIENT RESPONSE WHEN Cn IS
TOO LARGE
VO
RING
BACK
FIGURE 14. OUTPUT VOLTAGE RING BACK PROBLEM
18
FN7591.0
March 16, 2010