 English |
|
|
|
|
|
|
|
| 80C286 Datasheet, PDF (13/13 Pages) Intersil Corporation – High Performance Microprocessor with Memory Management and Protection | |||
| |||
| ◁ |
Die Characteristics
DIE DIMENSIONS:
286 x 283 x 19 ±1mils
METALLIZATION:
Type: Si-Al
Thickness: 8kÃ
Metallization Mask Layout
80C286/883
GLASSIVATION:
Type: Nitrox
Thickness: 10kÃ
WORST CASE CURRENT DENSITY: 2 X 105A/cm2
LEAD TEMPERATURE: (10s Soldering): ⤠300oC
80C286/883
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certiï¬cation.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or speciï¬cations at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
3-140
Spec Number
|
German
Russian
Spanish
Italian
Polish
Chinese
Japanese
Korean
French
Portuguese