ISL7457SRH Datasheet, PDF (11/12 Pages) Intersil Corporation – Radiation Hardened, SEE Hardened, Non-Inverting, Quad CMOS Driver

Layout Characteristics
Step and Repeat: 2390 µm x 2445 µm
The DELAY pad is not bonded.
ISL7457SRH
TABLE 1. LAYOUT X-Y COORDINATES
PAD NAME
X
(µm)
Y
DX
DY PROBES
(µm) (µm) (µm) PER PAD
IND
675
190
140
140
1
V_S-
OUTD
995
190
140
140
1
2118
490
122
133
1
OUTC
2118
795
122
133
1
V_H
2118
1039 122
345
2
2118
1211
OUTB
2118
1554 122
133
1
OUTA
2118
1861 122
133
1
V_S+
1015
2140 140
140
1
INA
608
2140 140
140
1
OE
213
1993 140
140
1
INB
213
1673 140
140
1
V_L
213
1331 140
345
2
213
1159
GND
213
864
140
140
1
DELAY
213
585
140
140
0
INC
213
213
140
140
1
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11
FN6874.0
March 16, 2009