FMGA-461_15 Datasheet, PDF (12/14 Pages) Interpoint Corporation Company – FMSA/FMGA EMI Input Filters 28 Volt Input - 0.8 AMP

0.900 (22.86)
0.800 (20.32)
0.700 (17.78)
0.600 (15.24)
0.500 (12.70)
0.400 (10.16)
0.300 ( 7.62)
0.200 ( 5.08)
0.100 ( 2.54)
Crane Aerospace & Electronics Power Solutions
FMSA/FMGA EMI Input Filters
28 Volt Input - 0.8 AMP
TOP VIEW CASE B FMGA
1
2
3
4
5
6
7
8
9
0.000
0.880 max
(22.35)
18
17
16
(This view shows
straight leads.)
15
14
13
12
11
10
1.010 max
(25.65)
0.015
(0.38)
CASE B1 GULL-WING SOLDER PADS FMGA CASE Z
0.090 (2.29)
0.070 (1.78)
0.830 (21.08)
0.030 (0.76) 18X
0.100 (2.54) 16X
The triangle (ESD) marking on the cover indicates pin one. Cover marking is oriented
with pin one at the upper right corner. The straight lead configuration does not
require a “case designator” in the model number. ex. FMGA-461
0.010
(0.25)
0.50
(12.7)
1.870 ref. (47.50)
0.08 (2.0)
Straight Leads
Seam seal
0.250 max.
(6.35)
0.135 ref. (3.43)
1.140 ref. (28.96)
1
0.010
(0.25)
Gull Wing Leads
1
Option
Gull wing leads are solder dipped.
Lead dimensions are prior to solder dip.
0.010 (0.25)
Bottom of case to
bottom of lead
0.055
(1.40)
The gull wing option
(configuration) requires
“Z” as a “case
designator”
in the model number.
ex. FMGA-461Z
(Center to center)
0.070
(1.78)
0.08
(2.0)
Seal hole: 0.040 ±0.002 (1.02 ±0.05)
Weight: 12 grams maximum
Case dimensions in inches (mm)
Tolerance ±0.005 (0.13) for three decimal places, ±0.01 (0.3) for two
decimal places unless otherwise specified. Please refer to the numerical
dimensions for accuracy.
CAUTION
Maximum reflow temperature is 220°C for a maximum of 30 seconds.
SN60, SN62, or SN63 are the recommended types of solder. See MGH
gull-wing solder pad layout. Hand soldering should not exceed 300°C for
10 seconds per pin.
Materials
Header Kovar/Nickel/Gold
Cover Kovar/Nickel
Pins
Kovar/Nickel/Gold matched glass seal
Gold plating of 50 - 150 microinches is included in pin diameter
Case B FMGA, Rev E, 2015.12.09
0.085 (2.16) 4X
Dimensions in inches (mm)
Tolerance ±0.005 (0.13) for three decimal places ±0.01 (0.3) for
two decimal places, unless otherwise specified.
Please refer to the numerical dimensions for accuracy.
CAUTION:
Internal components are soldered with SN96 (melting
temperature 221°C) to prevent damage during reflow. Maximum
reflow temperature for surface mounting the FMGA filter is
220°C for a maximum of 30 seconds. SN60, 62, or 63 are the
recommended types of solder.
Hand soldering should not exceed 300°C for 10 seconds per pin.
SOLDER MASK NOTES
1. Pad dimensions are for the solder mask. Leads common to
each other can be connected to each other as desired.
2. Ground (case) pins should be connected to the center pad for
improved grounding.
3. Connect "no connection" pins to case ground to reduce EMI.
4. Center pad should not have a solder mask.
5. Adhesive attach is intended to be a surface for soldering the
hybrid to the circuit board.
6. Pre-tin base of converter prior to soldering.
7. If less rotation of case is desired, reduce the width of the large
case pad by 0.020 inches (0.51 mm). Pad length can be
extended 0.010 inches (0.25 mm) towards the case body and an
as-desired dimension away from the case body.
8. Do not exceed 220°C as measured on the body of the
converter (top or bottom).
9. Attach the body of the case to the board with a thermally
conductive adhesive or SN60, 62, or 63 solder. The adhesive
can be electrically conductive as well. It can be applied as an
underfill post solder or dispensed and cured prior or during
solder.
10. In the presence of vibration, to ensure reliable mechanical
attachment, the body of the case should be attached with
adhesive or solder as noted above (note 7). The leads alone do
not provide sufficient mechanical attachment.
Case B1 FMGA Solder Pads, Rev F, 2013.05.31
Figure 16: Case B
www.craneae.com/interpointcom
Figure 17: Case B Solder Pad
Page 12 of 14
FMSA/FMGA Rev AA - 2015.12.15