273159-006 Datasheet, PDF (65/86 Pages) Intel Corporation – 80960JA/JF/JD/JS/JC/JT 3.3 V Embedded 32-Bit Microprocessor

80960JA/JF/JD/JS/JC/JT 3.3 V Embedded 32-Bit Microprocessor
Table 35. 80960JS/JC/JT 196-Ball MPBGA Package Thermal Characteristics
Thermal Resistance — °C/Watt
Parameter
θ_JC (Junction-to-Case)
θ_CA (Case-to-Ambient) (No Heatsink)
Airflow — ft./min (m/sec)
0
200
400
600
800
(0) (1.01) (2.03) (3.04) (4.06)
2
2
2
2
2
34
25
23
22
21
1000
(5.08)
2
20
θ_JA
θ_JC
θ_CA
NOTES:
1. This table applies to an MPBGA device soldered directly into a board with all V_SS connections.
2. θ_JA = θ_JC + θ_CA
Table 36. 132-Lead PQFP Package Thermal Characteristics
Thermal Resistance — °C/Watt
Parameter
θ_JC (Junction-to-Case)
θ_CA (Case-to-Ambient -No Heatsink)
Airflow — ft./min (m/sec)
0
50
100
200
400
(0)
(0.25) (0.50) (1.01) (2.03)
4.1
4.3
4.3
4.3
4.3
23
19
18
16
14
θ_JA
θ_CA
θ_JC
600
(3.04)
4.7
11
800
(4.06)
4.9
9
θ_JB
θ_JL
NOTES:
1. This table applies to a PQFP device soldered directly into board.
2. θ_JA = θ_JC + θ_CA
3. θ_JL = 13° C/W (approx.)
4. θ_JB = 13.5° C/W (approx.)
Datasheet
65