80960SB Datasheet, PDF (38/38 Pages) Intel Corporation – EMBEDDED 32-BIT MICROPROCESSOR WITH 16-BIT BURST DATA BUS

80960SB
The sections significantly changed between revisions -003 and -004 of the 80960SA/SB Data Sheet were:
Section
Last
Rev.
Description
DC Characteristics
-003
Operating temperature for PLCC package changed:
WAS:
T_CASE = 0°C to +100°C
IS:
T_CASE = 0°C to +85°C
The test program has not changed.
Table 7. QFP Package, Thermal Resis-
tance — °C/Watt
-003
Corrected QFP Package Thermal Resistance values:
for θ_JA at 0 ft./min.
airflow:
for θ_JC at 0 ft./min.
airflow:
WAS: 45.7° /W
WAS: 4° /W
IS:
54° /W
IS:
11° /W
Table 8. PLCC Package, Thermal Resis-
tance — °C/Watt
-003
Corrected PLCC Package Thermal Resistance val-
ues:
for θ_JA:
at 50 ft./min. airflow
at 100 ft./min. airflow
WAS:
NA
WAS:
NA
IS:
31
IS:
28.5
for θ_JC:
at 0 ft./min. airflow
at 50–1000 ft./min. airflow
WAS:
13
WAS:
NA
IS:
11
IS:
11
Table 9. 80960SA and 80960SB QFP
Pinout — In Pin Order
-003
Signal A12 incorrectly shown as Pin 28; is now cor-
rectly shown as Pin 38. Note added to clarify No Con-
nect Pins.
34