80960SB Datasheet, PDF (30/38 Pages) Intel Corporation – EMBEDDED 32-BIT MICROPROCESSOR WITH 16-BIT BURST DATA BUS

80960SB
3.4 Package Thermal Specifications
The 80960SB is specified for operation when case
temperature is within the range 0°C to +85°C (PLCC)
or 0°C to 100°C (QFP). Measure case temperature
at the top center of the package. Ambient temper-
ature can be calculated from:
T_J = T_C + P*θ_JC
T_A = T_J - P*θ_JA
T_C = T_A + P*[θ_JA−θ_JC]
Compute P by multiplying the maximum voltage by
the typical current at maximum temperature. Values
for θ_JA and θ_JC for various airflows are given in Table
13 for the QFP package and in Table 14 for the
PLCC package. I_CC at maximum temperature is
typically 80 percent of specified I_CC maximum (cold).
Table 13. 80960SB QFP Package Thermal Characteristics
Thermal Resistance — °C/Watt
Parameter
Airflow — ft./min (m/sec)
0
50 100 200 400 600 800
θ Junction-to-Ambient (Case
54
52
49
45
39
35
33
measured in the middle of the
top of the package)
(No Heatsink)
θ Junction-to-Case
11
11
11
11
11
11
11
NOTES:
This table applies to 80960SB QFP soldered directly to board.
Table 14. 80960SB PLCC Package Thermal Characteristics
Thermal Resistance — °C/Watt
Parameter
Airflow — ft./min (m/sec)
0
50 100 200 400 600 800
θ Junction-to-Ambient
33
31 28.5 27
24
22
20
(No Heatsink)
θ Junction-to-Case
11
11
11
11
11
11
11
NOTES:
This table applies to 80960SB PLCC soldered directly to board.
1000
19.5
11
26