80960SB Datasheet, PDF (24/38 Pages) Intel Corporation – EMBEDDED 32-BIT MICROPROCESSOR WITH 16-BIT BURST DATA BUS

80960SB
3.0 MECHANICAL DATA
3.1 Packaging
The 80960SB is available in two package types:
• 80-lead quad flat pack (EIAJ QFP). Shown in
Figure 15.
• 84-lead plastic leaded chip carrier (PLCC).
Shown in Figure 16.
Dimensions for both package types are given in the
Intel Packaging handbook (Order #240800).
3.2 Pin Assignment
The QFP and PLCC have different pin assignments.
The QFP pins are numbered in order from 1 to 80
around the package perimeter. The PLCC pins are
numbered in order from 1 to 84 around the package
perimeter. Tables 9 and 10 list the function of each
QFP pin; Tables 11 and 12 list the function of each
PLCC pin.
V_CC and GND connections must be made to multiple
V_CC and GND pins. Each V_CC and GND pin must be
connected to the appropriate voltage or ground and
externally strapped close to the package. It is recom-
mended that you include separate power and ground
planes in your circuit board for power distribution.
Pins identified as NC (No Connect) should never be
connected.
V_SS
ALE
READY
A31
A30
A29
A28
V_SS
V_CC
A27
A26
A25
V_CC
V_SS
A24
A23
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41
65
40
BE1
66
39
NC
67
38
A1
68
37
V_SS
69
36
V_CC
70
35
A2
71
S80960SB-16
34
A3
72
XXXXXXXX
33
V_CC
73
XXXXXX
32
V_SS
74
XXXXXX
31
D0
75
30
AD1
76
29
AD2
77
28
AD3
78
27
AD4
79
26
AD5
80
25
AD6
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
Figure 15. 80-Lead EIAJ Quad Flat Pack (QFP) Package
20