82573 Datasheet, PDF (33/39 Pages) Intel Corporation – GbE Controllers

Datasheet—82573
Table 21.
Thermal Resistance Values
Symbol
Parameter
TJ
Maximum junction temperature
⎝JA
Thermal resistance, junction-to-
ambient
⎝JC
Thermal resistance, junction-to-
case
Value at Specified Airflow (m/s)
0
127.1
1
122.1
2
119.3
3
117.5
26.0
23.7
22.4
21.6
6.1
6.1
6.1
6.1
Units
C
C/Watt
C/Watt
Thermal resistances are determined empirically with test devices mounted on standard
thermal test boards. Real system designs may have different characteristics due to
board thickness, arrangement of ground planes, and proximity of other components.
The case temperature measurements should be used to assure that the 82573 is
operating under recommended conditions. The use of a heat sink device is not
required.
4.3
Pinout Information
4.3.1
PCIe Bus Interface Signals
Table 22.
PCIe Data Signals
Signal
PE_CLKn
PE_CLKp
Pin
G2
G1
Signal
PE_T0n
PE_T0p
Pin
C1
D1
Signal
PE_R0n
PE_R0p
Pin
F1
F2
33