80C186EB Datasheet, PDF (22/59 Pages) Intel Corporation – 16-BIT HIGH-INTEGRATION EMBEDDED PROCESSORS

80C186EB 80C188EB 80L186EB 80L188EB
PACKAGE THERMAL
SPECIFICATIONS
The 80C186EB 80L186EB is specified for operation
when T_C (the case temperature) is within the range
of ^b40 C to ^a100 C (PLCC package) or ^b40 C to
a_{114 C (QFP package) TC may be measured in}
any environment to determine whether the proces-
sor is within the specified operating range The case
temperature must be measured at the center of the
top surface
T_A (the ambient temperature) can be calculated
from i_CA (thermal resistance from the case to ambi-
ent) with the following equation
T_A e T_C b P i_CA
Typical values for i_CA at various airflows are given
in Table 10 P (the maximum power consumption
specified in watts) is calculated by using the maxi-
mum ICC as tabulated in the DC specifications and
V_CC of 5 5V
Table 10 Thermal Resistance (i_CA) at Various Airflows (in C Watt)
Airflow Linear ft min (m sec)
0 200 400 600 800 1000
(0) (1 01) (2 03) (3 04) (4 06) (5 07)
i_CA (PLCC)
i_CA (QFP)
i_CA (SQFP)
30 24
58 47
70 TBD
21
43
TBD
19
40
TBD
17
38
TBD
16 5
36
TBD
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