PTFA071701E Datasheet, PDF (8/9 Pages) Infineon Technologies AG – Thermally-Enhanced High Power RF LDMOS FETs 170 W, 725 – 770 MHz

Confidential, Limited Internal Distribution
Package Outline Specifications (cont.)
Package H-37248-2
[45° X .107]
4.826±0.510
[.190±0.020]
D
[ ] FLANGE 9.779
[.385]
LID 9.398+-00.1.15000
.370+-00.0.00064
PTFA071701E
PTFA071701F
[ ] 4X R0.508+-.1.32871
R.020+-00.0.00155
19.431±0.510
[.765±0.020]
G
2X 12.700
[.500]
SPH 1.575
[.062]
19.812±0.200
[.780±0.008]
1.016
[.040]
0.0381 [.0015] -A-
3.632±0.380
S
[.143±0.015]
CL
20.574
[.810]
C66065-A2323-C001-01-0027_h-37248-2_11-11-09
Diagram Notes—unless otherwise specified:
1. Interpret dimensions and tolerances per ASME Y14.5M-1994.
2. Primary dimensions are mm. Alternate dimensions are inches.
3. All tolerances ± 0.127 [0.005] unless specified otherwise.
4. Pins: D = drain; S = source; G = gate.
5. Lead thickness: 0.102 +0.051/–0.025 [0.004 +0.002/–0.001].
6. Gold plating thickness: 1.14 ± 0.38 micron [45 ± 15 microinch] max.
Find the latest and most complete information about products and packaging at the Infineon Internet page
http://www.infineon.com/rfpower
Data Sheet
8 of 9
Rev. 03, 2009-11-11