SED10HB100 Datasheet, PDF (7/18 Pages) Solid States Devices, Inc – Schottky Rectifier

1
Ultra Low Capacitance ESD Array
ESD3V3U4ULC
Ultra Low Capacitance ESD Array
1.1
Features
• ESD / Transient protection of high speed data lines exceeding :
• IEC61000-4-2 (ESD) : ±20 kV (air/contact)
• IEC61000-4-4 (EFT) : 2.5 kV (5/50ns)
• IEC61000-4-5 (Surge) : 3 A (8/20ns)
• Maximum working voltage: V_RWM = 3.3 V
• Very low reverse current: I_R = 1 nA (typical)
• Extremely low capacitance C_L = 0.4 pF I/O to GND (typical)
• Very low reverse clamping voltage: V_CL= 9 V at I_PP = 16 A (typical)
• Very low forward clamping voltage: V_FC= 6 V at I_PP = 16 A (typical)
• Very low reverse dynamic resistance: R_dyn,rev = 0.2 Ω (typical)
• TSLP-9-1 package with pad pitch 0.5 mm
• Optimized pad design to simplify PCB layout
• Pb-free and Halogen-Free package (RoHS compliant)
1.2
Application Examples
• USB 3.0, 10/100/1000 Ethernet, Firewire
• DVI, HDMI, S-ATA, DisplayPort, Mobile communication, LCD displays, Camera
• Consumer products (STB, MP3, DVD, DSC, ...) Notebooks and desktop computers, peripherals
2
Product Description
Pin 1 Pin 2
Pin 3
Pin 4 Pin 5
Pin 1 Pin 2 Pin 4 Pin 5
I/O
I/O
I/O
I/O
Pin 9 Pin 8
Pin 7 Pin 6
a) Pin configuration
Figure 1 a) Pin Configuration and b) Schematic Diagram
Table 1 Ordering information
Type
Package
ESD3V3U4ULC
PG-TSLP-9-1
Configuration
4 lines, uni-directional
Preliminary Data Sheet
7
GND
Pin 3
b) Schematic diagram
Marking code
Z2
Revision 0.9, 2010-10-14