BFS469L6 Datasheet, PDF (7/8 Pages) Infineon Technologies AG – NPN Silicon RF TWIN Transistor

Package TSLP-6-1
BFS469L6
Package Outline
Top view
0.4 ^+0.1
0.05 MAX.
4
5
3
6
2
1
Pin 1 marking
1) Dimension applies to plated terminal
Bottom view
0.8±0.05
0.45±0.05
3
4
2
0.55 ±0.05
5
1
6
2 x 0.35 ±0.0351)
4 x 0.15 ±0.0351)
Foot Print
For board assembly information please refer to Infineon website "Packages"
0.8
0.8
0.76
R0.125
Marking Layout
0.37
0.25
0.18
Copper Solder mask
0.25
0.29
0.25
0.22
Only 100 µm stencil thickness
recommended
Stencil apertures
Type code
BFS360L6
Laser marking
Standard Packing
Reel ø180 mm = 15.000 Pieces/Reel
4
Example
0.5
Pin 1 marking
Pin 1
1.05
marking
7
2005-10-11