HYS64D32020GDL5C Datasheet, PDF (6/30 Pages) Infineon Technologies AG – 200-Pin Small Outline Dual-In-Line Memory Modules

200-Pin Small Outline Dual-In-Line Memory Modules
HYS64D32020[H/G]DL–5–C
SO-DIMM
HYS64D[32020/16000][H/G]DL–6–C
1
Overview
1.1
Features
• Non-parity 200-Pin Small Outline Dual-In-Line Memory Modules
• One rank 16M ×64 and two ranks 32M ×64 organization
• JEDEC standard Double Data Rate Synchronous DRAMs (DDR SDRAM)
• Single +2.5 V (± 0.2 V) power supply
• Built with 256 Mbit DDR SDRAMs organised as ×16 in P–TSOPII–66–1 packages
• Programmable CAS Latency, Burst Length, and Wrap Sequence (Sequential & Interleave)
• Auto Refresh (CBR) and Self Refresh
• All inputs and outputs SSTL_2 compatible
• Serial Presence Detect with E²PROM
• Jedec standard form factor: 67.60 mm × 31.75 mm × 2.4 / 3.80 mm
• Jedec standard reference layout Raw Cards A and C
• Gold plated contacts
Table 1 Performance
Part Number Speed Code
Speed Grade
max. Clock Frequency
Component
Module
@CL3
@CL2.5
@CL2
f_CK3
f_CK2.5
f_CK2
–5
DDR400B
PC3200–3033
200
166
133
–6
DDR333B
PC2700–2533
166
166
133
Unit
—
—
MHz
MHz
MHz
2
Description
The HYS64D32020[H/G]DL–5–C and HYS64D[32020/16000][H/G]DL–6–C are industry standard 200-Pin Small
Outline Dual-In-Line Memory Modules (SO-DIMMs) organized as 32M × 64 and 16M × 64. The memory array is
designed with Double Data Rate Synchronous DRAMs (DDR SDRAM). A variety of decoupling capacitors are
mounted on the PC board. The DIMMs feature serial presence detect based on a serial E²PROM device using the
2-pin I²C protocol. The first 128 bytes are programmed with configuration data and the second 128 bytes are
available to the customer.
Data Sheet
6
Rev. 1.0, 2004-03