TLE5012 Datasheet, PDF (55/57 Pages) Infineon Technologies AG – GMR-Based Angular Sensor for Rotor Position Sensing

4
Package Information
TLE5012
Package Information
4.1
Package Parameters
Table 20 Package Parameters
Parameter
Symbol Limit Values
Unit
min. typ. max.
Thermal Resistance
R_thJA
-
R_thJC
-
R_thJL
-
Soldering Moisture Level
150 200 K/W
- 75 K/W
- 85 K/W
MSL 3
Lead Frame
Cu
Plating
1) according to Jedec JESD51-7
Sn 100%
4.2
Package Outline
Notes
Junction to Air¹⁾
Junction to Case
Junction to Lead
260°C
> 7 µm
0.35 x 45˚
4 _-0.2 ¹⁾
A
C _{1.22 ±0.18}
1.27
0.41
+0.1
-0.06
2)
B
0.1
0.2 M A B 8x SEATING
PLANE
0.64 ±0.25
6 ±0.2
E
0.2 M C 8x
4)
D
3 x 1.27 = 3.81
85
Index
Marking
A
14
5 _-0.2 ¹⁾
0.75 D E
CENTER OF
SENSITIVE
AREA
Detail A
ø0.6 Sensitive Area ³⁾
Figure 30
1) Does not include plastic or metal protrusion of 0.15 max. per side
2) Lead width can be 0.61 max. in dambar area
3) Max. 3˚ tilt of sensitive area to preference "B"
4) Reference "D" is defined with the center of all 8 pins
P-PG-DSO-08-16-S-PO V03
PG-DSO-8 Package Dimension
Target Data Sheet
55
V 0.46, 2009-09