TLE7368_10 Datasheet, PDF (39/41 Pages) Infineon Technologies AG – Next Generation Micro Controller Supply

TLE7368
Package Outlines
0.65
C
17 x 0.65 = 11.05
0.1 C 36x
SEATING PLANE
0.33 ±0.08 ²⁾
36
0.17 M A-B C D 36x
A
19 _{Ejector Mark}
0.35 x 45˚
7.6 _-0.2 ¹⁾
0.7 ±0.2
10.3 ±0.3
D
Bottom View
19
36 _{Exposed Diepad}
1
18
B
12.8
1)
-0.2
Index Marking
18 _Ex 1 Index Marking
Exposed Diepad Dimensions ⁴⁾
Package
Leadframe Ex Ey
PG-DSO-36-24, -41, -42 A6901-C001 7 5.1
PG-DSO-36-38
A6901-C003 7 5.1
PG-DSO-36-38
A6901-C007 5.2 4.6
PG-DSO-36-50
A6901-C008 6.0 5.4
1) Does not include plastic or metal protrusion of 0.15 max. per side
2) Does not include dambar protrusion of 0.05 max. per side
3) Distance from leads bottom (= seating plane) to exposed diepad
4) Excluding the mold flash allowance of 0.3 max per side
PG-DSO-36-24, -38, -41, -42, -50-PO V09
Figure 12 PG-DSO-36 (Plastic Green - Dual Small Outline Package)
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant with
government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e
Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
For additional package information, please go to the Infineon Internet
Page “Products”: http://www.infineon.com/products.
Dimensions in mm
Data Sheet
39
Rev. 2.1, 2010-11-22