BGA751N7 Datasheet, PDF (37/39 Pages) Infineon Technologies AG – SiGe Bipolar 3G/3.5G/4G Single-Band LNA

BGA751N7
SiGe Bipolar 3G/3.5G/4G Single-Band LNA
Physical Characteristics
4
Physical Characteristics
4.1
Package Footprint
NSMD
1.4
1.4
SMD
1.4
1.4
0.3
0.3
0.3
Copper Solder mask
0.25
R0.1
0.25
Stencil apertures
0.3
0.3
0.3
Copper Solder mask
Figure 11 Footprint Recommendation 1 for the TSNP-7-1 Package
0.25
0.25
NSMD
0.5
0.25
0.25
0.25
R0.1
0.25
Stencil apertures
TSNP-7-1-FP V01
1.2
1.25
1.25
Figure 12
Copper Solder mask
Stencil apertures
TSNP-7-1-N-FP V01
Footprint Recommendation 2 for the TSNP-7-1 Package
Data Sheet
37
Revision 3.1, 2013-01-31