TLE7824G Datasheet, PDF (35/53 Pages) Infineon Technologies AG – Integrated double low-side switch, high-side/LED driver, hall supply, wake-up inputs and LIN communication with embedded MCU (24kB Flash)

TLE7824G
General Product Characteristics
Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are
not designed for continuous repetitive operation.
16.2
Functional Range
Table 13 Operating Range
Pos. Parameter
16.2.1 Supply voltage
Symbol
V_S
Limit Values
Min. Max.
3.9
27
16.2.2 Voltage range at LSx pins
V_LSx
-0.3
27
16.2.3 External output current at pin V_CC I_{CC_ext} –
16.2.4 Supply voltage slew rate
dV_S/dt -0.5
16.2.5 Logic input voltage (TMS, TCK, V_I
-0.3
TDI, CLKIN)
16.2.6 Output capacitor connected to C_CC
1
V_CC pin
5
5
V_CC +
0.3 V
–
16.2.7 SPI clock frequency
f_clk
–
4
16.2.8 Junction temperature
T_j
-40
150
16.2.9 Delay time for operating mode t_chmode 10
–
change
Unit
V
V
mA
V/μs
V
μF
MHz
°C
μs
Conditions
40 V load dump; t ≤ 0.4 s;
27V jump start; t ≤ 60s;
V_{S (min)} valid for ramp-down
40 V load dump; t ≤ 0.4s;
can withstand short circuit
to V_S ≤ 20V
external loads
–
–
ESR < 6 Ω
@ f = 10 kHz;
100 nF in parallel
recommended
–
–
min. time between 2 SPI
commands; CSN “high”
16.3
Thermal Resistance
Pos. Parameter
Symbol
Limit Values
Unit Conditions
Min. Typ. Max.
16.3.1 Junction to Soldering Point¹⁾
R_thJSP
–
–
17
K/W measured to pin
7,8,22
16.3.2 Junction to Ambient¹⁾
R_thJA
–
1) Not subject to production test, specified by design
43
–
K/W ²⁾
2) Specified R_thJA value is according to Jedec JESD51-2,-7 at natural convection on FR4 2s2p board; The Product
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).
Data Sheet
35
Rev. 3.01, 2008-04-15