TLE7232GS Datasheet, PDF (30/32 Pages) Infineon Technologies AG – SPI Driver for Enhanced Relay Control

7
Package Outlines
SPI Driver for Enhanced Relay Control
SPIDER - TLE7232GS
Package Outlines
8˚ MAX.
0.35 x 45˚
3.9 ±0.11)
C
8˚ MAX.
0.65
0.25 ±0.05 ²⁾
0˚...8˚ ^B
0.1 B
Seating Plane
0.17 M C A B 24x
0˚...8˚
0.64 _±0.25
6 ±0.2
0.2 M C
24
13
1
12
A
8.65 ±0.11)
Index Marking
1) Does not include plastic or metal protrusion of 0.15 max. per side
2) Does not include dambar protrusion of 0.13 max.
3) JEDEC registration MO-137 variation AE
GPS01214
Figure 17 PG-SSOP-24-6 (Plastic Green Shrink Small Outline Package)
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant with
government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e
Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
For further information on alternative packages, please visit our website:
http://www.infineon.com/packages.
Data Sheet
30
Dimensions in mm
Rev. 1.0, 2007-12-18