TLE7232GS Datasheet, PDF (10/32 Pages) Infineon Technologies AG – SPI Driver for Enhanced Relay Control

SPI Driver for Enhanced Relay Control
SPIDER - TLE7232GS
General Product Characteristics
Absolute Maximum Ratings (cont’d)¹⁾
T_j = -40 °C to 150 °C; V_DD = 4.5 V to 5.5 V; all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified)
Pos.
Parameter
Symbol
Limit Values
Unit Conditions
Min.
Max.
ESD Susceptibility
4.1.16 ESD capability of all pins versus GND V_ESD
-2
2
1) Not subject to production test, specified by design.
kV HBM⁵⁾
2) V_DD + 0.3 V < 5.5 V
3) Details on configuration of protective function OLCR.OVL can be found in Section 5.2.5
4) Pulse shape represents inductive switch off: I_D(t) = I_D(0) × (1 - t / t_pulse); 0 < t < t_pulse
5) ESD susceptibility, HBM according to EIA/JESD 22-A114B
Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are
not designed for continuous repetitive operation.
4.2
Thermal Resistance
Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go
to www.jedec.org.
Pos. Parameter
Symbol
Limit Values
Unit Conditions
Min. Typ. Max.
4.2.17
4.2.18
Junction to Solder Point
Junction to Ambient
(1s0p+600mm² Cu)
R_thJSP
–
R_thJA
–
–
25
K/W pin 1, 2, 11, 12¹⁾
64
–
K/W ¹⁾²⁾
4.2.19 Junction to Ambient (2s2p)
R_thJA
–
55
–
K/W ¹⁾³⁾
1) Specified R_thJSP value is simulated at natural convection on a cold plate setup (all pins are fixed to ambient temperature).
T_a = 25 °C. LS0 to LS7 are dissipating 1 W power (0.125 W each).
2) Specified R_thJA value is according to Jedec JESD51-2,-3 at natural convection on FR4 1s0p board; The product
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with additional heatspreading copper area of 600mm²
and 70 µm thickness. T_a = 25 °C, LS0 to LS7 are dissipating 1 W power (0.125 W each).
3) Specified R_thJA value is according to Jedec JESD51-2,-7 at natural convection on FR4 2s2p board; The product
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70 µm Cu, 2 x 35 µm Cu).
T_a = 25 °C, LS0 to LS7 are dissipating 1 W power (0.125 W each).
Data Sheet
10
Rev. 1.0, 2007-12-18