TLE5009-E2000 Datasheet, PDF (28/32 Pages) Infineon Technologies AG – GMR-Based Angular Sensor

TLE5009
Package Information
4
Package Information
The TLE5009 comes in a green SMD package with lead-free plating, the PG-DSO-8. For alternative packaging,
such as bare die please contact Infineon.
4.1
Package Parameters
Table 10 Package parameters
Parameter
Symbol Limit Values
Unit
min. typ. max.
Thermal Resistance
Soldering Moisture Level
R_thJA
R_thJC
R_thJL
150 200 K/W
75 K/W
85 K/W
MSL 3
Lead Frame
Cu
Plating
1) According to Jedec JESD51-7
Sn 100%
4.2
Package Outline
Notes
Junction-to-Air¹⁾
Junction-to-Case
Junction-to-Lead
260°C
> 7 µm
Figure 15 Package dimensions
Data Sheet
28
Rev. 1.1, 2012-04