TLE5009-E2000 Datasheet, PDF (14/32 Pages) Infineon Technologies AG – GMR-Based Angular Sensor

TLE5009
Specification
Calculation of the Junction Temperature
The total power dissipation P_TOT of the chip increases its temperature above the ambient temperature.
The power multiplied by the total thermal resistance R_thJA (Junction-to-Ambient) leads to a calculation of the final
junction temperature. R_thJA is the sum of the addition of the values of the two components Junction-to-Case and
Case-to-Ambient.
R_thJA = R_thJC + R_thCA
T_J = T_A + ΔT
(2)
ΔT = R_thJA × P_TOT = R_thJA × (V_DD × I _DD + (V_DD − V_OUT ) × I_OUT )
Example (assuming no load on V_out):
V_DD = 5V
I_DD = 7mA
ΔT
=
150_{⎢⎣⎡WK}
⎤
⎥⎦
× (5[V
]×
0.007[A]+
0[VA])
=
5.25K
(3)
For molded sensors, the calculation with R_thJC is more appropriate.
Data Sheet
14
Rev. 1.1, 2012-04