PTFB211503EFL Datasheet, PDF (13/14 Pages) Infineon Technologies AG – Thermally-Enhanced High Power RF LDMOS FETs

PTFB211503EL
PTFB211503FL
Package Outline Specifications (cont.)
Package H-34288-4/2
45° X 2.032
[45° X .080]
22.860
[.900]
2X 30°
V
CL
D
V
2X 5.080
[.200]
2X 1.143
[.045]
4.889±.510
[.192±.020]
CL
4X
R0.508
+.381
-.127
[^{R.020+-.0.00155} ]
G
2X 12.700
[.500]
22.352±.200
[.880±.008]
9.398
[.370]
9.779
[.385]
19.558±.510
[.770±.020]
4.039
+.254
-.127
[^.159
] ^+.010
-.005
1.575
[.062] (SPH)
1.016
[.040]
H-34288-4/2_po_03_08-13-2012
CL
23.114
[.910]
S

Diagram Notes—unless otherwise specified:
1. Interpret dimensions and tolerances per ASME Y14.5M-1994.
Diagram_2.No_Pt_re_ims—_aru_yn_dle_imss_eno_sth_ioe_nrw_s i_as_re_es_mpe_mc_.if_Aie_ltd_e:_{rnate dimensions are inches.}
1₃._. I_An_lt_le_tr_op_lere_rat _nd_cim_esen_±s₀io_.1n₂s₇a_[n₀d_.0t₀o₅le_] r_ua_nn_lece_{ss s}p_pe_er _cA_ifS_ieM_dE_otY_h1_e4_rw.5_iM_se-_.1994.
24.. PPriinmsa: Dry–didmraeinns; iGon–s gaaretem; Sm–. Asloteurncea;teVd–imVe_DDnsions are inches.
35.. ALlel atodlethraicnkcneesss±: 00..11207+[.00.0055]1u/–n0le.0s2s5spmemcif[i0e.d00o4th+er0w.0is0e2./–0.001 inch].
46.. PGinosld: Dpla=tidnrgatinh;icSkn=esos:u0rc.2e5; Gmi=crgoante[1; 0V m=iVcr_Do_Din. ch] max.
5. Lead thickness: 0.10 + 0.051/–0.025 mm [.004 +0.002/–0.001 inch].
6. Gold plating thickness: 0.25 micron [10 microinch] max.
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http://www.infineon.com/rfpower
Data Sheet
13 of 14
Rev. 04.1, 2016-06-14