TLE82452-3SA_15 Datasheet, PDF (12/71 Pages) Infineon Technologies AG – 2 Channel High-Side and Low-Side Linear Solenoid Driver IC

TLE82452-3SA
4.3
Thermal Resistance
General Product Characteristics
Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go
to www.jedec.org.
Table 3 Thermal Resistance
Parameter
Symbol
Values
Unit Note /
Number
Min. Typ. Max.
Test Condition
Junction to Case¹⁾
Junction to Ambient
R_thJC
R_thJA
–
–
2
K/W –
–
15
–
K/W ²⁾
P_4.3.1
P_4.3.2
1) Not subject to production test, specified by design.
2) Specified R_thJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The Product
(Chip+Package) was simulated on a 76.2 × 114.3 × 1.5 mm board with 2 inner copper layers (2 × 70 mm Cu, 2 × 35 mm
Cu). Where applicable a thermal via array under the exposed pad contacted the first inner copper layer.
Data Sheet
-
12
Rev 1.0, 2015-03-27