TLE7233G Datasheet, PDF (10/32 Pages) Infineon Technologies AG – SPI Driver for Enhanced Relay Control

SPI Driver for Enhanced Relay Control
SPIDER - TLE7233G
General Product Characteristics
4) ESD susceptibility, HBM according to EIA/JESD 22-A114B
Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are
not designed for continuous repetitive operation.
4.2
Functional Range
Pos.
4.2.1
4.2.2
4.2.3
4.2.4
Parameter
Symbol
Digital supply voltage
Analog supply voltage
Digital supply current all channels
ON
V_DD
V_DDA
I_DD(ON)
Analog supply current all channels I_DDA(ON)
ON
Limit Values
Min.
Max.
3. 0
5.5
4.5
5.5
–
0.5
–
5
Unit Conditions
V
–
V
–
mA –
mA –
Note: Within the functional range the IC operates as described in the circuit description. The electrical
characteristics are specified within the conditions given in the related electrical characteristics table.
4.3
Thermal Resistance
Note: This thermal data was generated in accordance with JEDEC JESD51 standards.
For more information, go to www.jedec.org.
Pos. Parameter
Symbol
Limit Values
Unit Conditions
Min. Typ. Max.
4.3.5 Junction to Soldering Point
R_thJSP
–
–
29
K/W pin 2,6, 11, 19¹⁾
4.3.6 Junction to Ambient
R_thJA
–
47
–
K/W ¹⁾²⁾
1) Specified R_thJSP value is simulated at natural convection on a cold plate setup (all pins are fixed to ambient temperature).
T_a = 25 °C. LS0 to LS3 are dissipating 1 W power (0.25 W each).
2) Specified R_thJA value is according to Jedec JESD51-2,-7 at natural convection on FR4 2s2p board; The product
(Chip+Package PG-SSOP-24) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70 µm Cu,
2 x 35 µm Cu). T_a = 25 °C, LS1 to LS3 are dissipating 1 W power (0.25 W each).
Datasheet
10
Rev. 1.0, 2008-02-28