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ICS8S89833I Datasheet, PDF (6/16 Pages) Integrated Device Technology – Four differential LVDS outputs
ICS8S89833I Data Sheet
LOW SKEW, 1-TO-4 DIFFERENTIAL-TO-LVDS FANOUT BUFFER W/INTERNAL TERMINATION
AC Electrical Characteristics
Table 5. AC Characteristics, VDD = 3.3V ± 0.3V, TA = -40°C to 85°C
Symbol Parameter
Test Conditions
fOUT
tPD
Output Frequency
Propagation Delay,
(Differential); NOTE 1
IN-to-Qx
tsk(o) Output Skew; NOTE 2, 3
tsk(pp) Part-to-Part Skew; NOTE 3, 4
tjit(cc) Cycle-to-Cycle Jitter, RMS; NOTE 5, 6
ƒ= 622.08MHz,
tjit
Buffer Additive Jitter; RMS; refer to
Additive Phase Jitter Section
Integration Range: 12kHz - 20MHz
ƒ ≥ 156.25MHz,
Integration Range: 12kHz - 20MHz
tS
Clock Enable
Setup Time
EN to IN/nIN
tH
Clock Enable
Hold Time
EN to IN/nIN
tR / tF Output Rise/Fall Time
20% – 80%
Minimum Typical
400
0.03
Maximum
2
600
30
200
3.5
0.25
300
500
75
200
Units
GHz
ps
ps
ps
ps
ps
ps
ps
ps
ps
NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is
mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium
has been reached under these conditions.
NOTE: All parameters characterized at ≤ 1.4GHz unless otherwise noted.
NOTE 1: Measured from the differential input crossing point to the differential output crossing point.
NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions.
Measured at the output differential cross points.
NOTE 3: This parameter is defined in accordance with JEDEC Standard 65.
NOTE 4: Defined as skew between outputs on different devices operating at the same supply voltage, same frequency, same temperature and
with equal load conditions. Using the same type of inputs on each device, the outputs are measured at the differential cross points.
NOTE 5: Tested at ƒ ≤ 750MHz.
NOTE 6: The cycle-to-cycle jitter is dependent on the input source and measurement equipment.
ICS8S89833AKI REVISION A JULY 13, 2010
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©2010 Integrated Device Technology, Inc.