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ICS8S89833I Datasheet, PDF (14/16 Pages) Integrated Device Technology – Four differential LVDS outputs
ICS8S89833I Data Sheet
LOW SKEW, 1-TO-4 DIFFERENTIAL-TO-LVDS FANOUT BUFFER W/INTERNAL TERMINATION
Package Outline and Package Dimensions
Package Outline - K Suffix for 16 Lead VFQFN
Seating Plane
Index Area
N
A1
A3 L
Top View
Anvil
Singulation
or
Sawn
Singulation
E 2 E2
2
(ND-1)x e
(R ef.)
N
D
Chamfer 4x
0.6 x 0.6 max
OPTIONAL
A
0. 08 C
e
(Ref.)
ND & NE
Odd
C
D2
2
D2
(Ref.)
ND& NE
Even
e (Typ.)
2 If ND & NE
1 are Even
2
(NE -1)x e
(Re f.)
b
Thermal
Base
Bottom View w/Type A ID
Bottom View w/Type B ID
4
2
1
CHAMFER
4
N N-1
There are 3 methods of indicating pin 1 corner
4
at the back of the VFQFN package are:
1. Type A: Chamfer on the paddle (near pin 1)
2. Type B: Dummy pad between pin 1 and N.
3. Type C: Mouse bite on the paddle (near pin 1)
Table 8. Package Dimensions
JEDEC Variation: VEED-2/-4
All Dimensions in Millimeters
Symbol Minimum Maximum
N
16
A
0.80
1.00
A1
A3
b
ND & NE
D&E
D2 & E2
e
L
0
0.05
0.25 Ref.
0.18
0.30
4
3.00 Basic
1.00
1.80
0.50 Basic
0.30
0.50
Reference Document: JEDEC Publication 95, MO-220
ICS8S89833AKI REVISION A JULY 13, 2010
2
1
DD
4
14
N N-1
AA
4
Bottom View w/Type C ID
2
1
RADIUS
4
N N-1
©2010 Integrated Device Technology, Inc.