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843003AGLF Datasheet, PDF (16/21 Pages) Integrated Device Technology – FEMTOCLOCKS™ CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER
ICS843003
FEMTOCLOCKS™ CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS843003.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS843003 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
• Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 158mA = 547.5mW
• Power (outputs)MAX = 30mW/Loaded Output pair
If all outputs are loaded, the total power is 3 * 30mW = 90mW
Total Power_MAX (3.3V, with all outputs switching) = 547.5mW + 90mW = 637.5mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device.
The maximum recommended junction temperature for HiPerClockS devices is 125°C.
The equation for Tj is as follows: Tj = θJA * Pd_total + TA
Tj = Junction Temperature
θJA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming a moderate
air flow of 1 meter per second and a multi-layer board, the appropriate value is 65°C/W per Table 8below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.638W * 65°C/W = 111.5°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type
of board (single layer or multi-layer).
Table 8. Thermal Resitance θJA for 24 Lead TSSOP, Forced Convection
θJA vs. Air Flow
Meters per Second
0
1
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
70°C/W
65
62
IDT™ / ICS™ LVPECL FREQUENCY SYNTHESIZER
16
ICS843003AG REV. A OCTOBER 23, 2008