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ICS874003-05 Datasheet, PDF (15/18 Pages) Integrated Device Technology – PCI EXPRESS™ JITTER ATTENUATOR
ICS874003-05
PCI EXPRESS™ JITTER ATTENUATOR
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS874003-05.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS74003-05 is the sum of the core power plus the analog power plus the power dissipated in the
load(s). The following is the power dissipation for VDD = 3.3V + 5% = 3.465V, which gives worst case results.
• Power (core)MAX = VDD_MAX * (IDD_MAX + IDDA_MAX) = 3.465V * (75mA + 16mA) = 315.315mW
• Power (outputs)MAX = VDDO_MAX * IDDO_MAX = 3.465V * 75mA = 259.875mW
Total Power_MAX = 315.3mW + 259.9mW = 575.2mW
•
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device.
The maximum recommended junction temperature for HiPerClockS devices is 125°C.
The equation for Tj is as follows: Tj = θJA * Pd_total + TA
Tj = Junction Temperature
θJA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming no air flow
and a multi-layer board, the appropriate value is 86.7°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.575W * 86.7°C/W = 119.9°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type
of board.
Table 6. Thermal Resistance θJA for 20 Lead TSSOP, Forced Convection
θJA by Velocity
Meters per Second
0
Multi-Layer PCB, JEDEC Standard Test Boards
86.7°C/W
1
82.4°C/W
2.5
80.2°C/W
IDT™ / ICS™ PCI EXPRESS™ JITTER ATTENUATOR
15
ICS874003BG-05 REV. A APRIL 15, 2009