ICS8741004I Datasheet, PDF (13/20 Pages) Integrated Device Technology – DIFFERENTIAL-TO-LVDS/0.7V DIFFERENTIAL PCI EXPRESS™ JITTER ATTENUATOR

ICS8741004I
DIFFERENTIAL-TO-LVDS/0.7V DIFFERENTIAL PCI EXPRESS™ JITTER ATTENUATOR
PRELIMINARY
Thermal Release Path
The expose metal pad provides heat transfer from the device to the
P.C. board. The expose metal pad is ground pad connected to
ground plane through thermal via. The exposed pad on the device
to the exposed metal pad on the PCB is contacted through solder
as shown in Figure 6. For further information, please refer to the
Application Note on Surface Mount Assembly of Amkor’s
Thermally /Electrically Enhance Leadframe Base Package, Amkor
Technology.
SOLDER
PIN
EXPOSED HEAT SLUG
SOLDER _PIN
PIN PAD
GROUND PLANE
THERMAL VIA
LAND PATTERN
(GROUND PAD)
Figure 6. P.C. Board for Exposed Pad Thermal Release Path Example
SOLDER
PIN PAD
IDT™ / ICS™ PCI EXPRESS™ JITTER ATTENUATOR
13
ICS8741004BGI REV. B SEPTEMBER 27, 2007