ICS9220B Datasheet, PDF (11/16 Pages) Integrated Device Technology – Programmable RambusTM XDRTM Clock Generator

ICS9220B
Programmable Rambus^TM XDR^TMClock Generator
AC Characteristics-Inputs
T_A = -40°C to +85°C; Supply Voltage AVDD2.5, VDD2.5 = 2.5 V +/- 5% (unless otherwise stated)
PARAMETER
SYMBOL
CONDITION
MIN TYP
CLK_INT/CLK_INC cycle time¹
t_CYCLEIN
9
10
Cycle-to-Cycle Jitter
t_cyc-t_cyc2
Input clock duty cycle
d_tin
over 10,000 cycles
40
CLK_INT/CLK_INC rise and fall time t_R, t_F 20% to 80% of input voltage 175
Difference between input rise and fall
time on same pin of a single device
t_R-F
20% to 80% of input voltage
-
Spread spectrum modulation frequency f_INM3
30
Spread spectrum modulation index
m_INDEX3
Triangular modulation
Non-triangular modulation
Input clock slew rate
Input Capacitance⁵
Input Capacitance⁵
CLK_INT cycle time
SMBus clock frequency
t_sl(I)
20% to 80% of input voltage
1
C_INCLK
CLK_INT, CLK_INC
C_IN
VI = V_DD2.5 or GND
t_CYCLETST
Bypass Mode
4
f_SMB
10
MAX
11
185
60
700
UNITS
ns
ps
%
ps
150
ps
33 kHz
0.6
%
0.54 %
4
V/ns
7
pF
10
pF
40
ns
100 kHz
Notes:
1 Measured at (V_IH(nom) - V_IL(nom))/2 and is the absolute value of the worst case deviation.
2 Measured at crossing points for differential clock input or at VTH for single- ended clock input.
3 If input modulation is used. Input modulation is not necessary.
4 The amount of allowed spreading for non-triangular modulation is determined by the induced downstream
tracking skew.
5 Capacitance measured at f = 1 MHz, DC bias = 0.9V, VAC <100mV.
Thermal Characteristics
Parameter
Symbol Conditions
Thermal Resistance Junction to
Ambient
Thermal Resistance Junction to Case
Thermal Resistance Junction to Top of
Case
Maximum Case Temp
θ_JA Still air
θ_JA 1 m/s air flow
θ_JA 3 m/s air flow
θ_JC
Ψ_JT Still Air
Min.
Typ.
120
95
80
20
4.5
Max.
120
Units
°C/W
°C/W
°C/W
°C/W
°C/W
°C
IDT^TM Programmable Rambus^TM XDR^TMClock Generator
11
1427A—01/26/10